US Patent Issued to QUALCOMM on Jan. 20 for "Power aware thermal mitigation framework" (Indian Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,064, issued on Jan. 20, was assigned to QUALCOMM Inc. (San Diego).

"Power aware thermal mitigation framework" was invented by Lakshmi Kanth Boddu (Dundigal Gandimaisamma, India), Rohit Singh (Hyderabad, India) and Srikar Karnam Venkat Naga (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects relate to mechanisms for providing a power aware thermal mitigation framework for a system-on-chip (SoC) of a device (e.g., a mobile device). A thermal controller of the SoC is configured to calculate a respective power of each of a plurality of electronic control units (ECUs) on the SoC at run time. The ECUs may include, for example, central...