ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,107, issued on Feb. 24, was assigned to QUALCOMM Inc. (San Diego).
"Package comprising optical integrated device" was invented by Xia Li (San Diego), Aniket Patil (San Diego) and Dongming He (San Diego).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a package substrate; a first integrated device coupled to the package substrate through a first plurality of solder interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a plurality of post interconnects at least partially located in the encapsulation layer; a metallization portion coupled to the plurality of post interconnects; a second i...