US Patent Issued to QUALCOMM on Dec. 2 for "High density linear capacitor in semiconductor technologies" (American, Indian Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,504, issued on Dec. 2, was assigned to QUALCOMM Inc. (San Diego).

"High density linear capacitor in semiconductor technologies" was invented by Bruce Lee (Irvine, Calif.), Chandra Satya Priyanka Tirupathi (Bangalore, India), Liang Dai (San Diego) and Dinesh Jagannath Alladi (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a first plurality of MEOL interconnects coupled to a second node that extends in a first direction. The first plurality of MEOL interconnects includes first and second subsets of MEOL second-terminal interconnects. The device includes a second plurality of MEOL interconnects coupled to a first node that ex...