ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,188, issued on Dec. 16, was assigned to QUALCOMM Inc. (San Diego).
"Flip-chip bumping metal layer and bump structure" was invented by Dongming He (San Diego), Jun Chen (San Diego), Yangyang Sun (San Diego), Lily Zhao (San Diego) and Ahmer Syed (San Diego).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are techniques for integrated circuit device. In an aspect, an integrated circuit device includes a metallization structure that includes a top metal layer structure; a passivation layer on the metallization structure; a bump structure disposed on the first bump line structure; and a first polymer protection layer. The passivation layer may in...