US Patent Issued to QUALCOMM on Aug. 11 for "Multi-frame three-dimensional (3D) reconstruction" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,705,827, issued on Aug. 11, was assigned to QUALCOMM Inc. (San Diego).

"Multi-frame three-dimensional (3D) reconstruction" was invented by Adithya Reddy Nallabolu (San Diego) and Gokce Dane (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are systems and techniques for image processing. For example, a computing device can project a sample location (of a plurality of sample locations) of a block of a scene onto depth frames to determine pixel values for the sample location. Each of the depth frames corresponds to a pose and includes a depth prediction value corresponding to the sample location. The computing device can read the depth p...