US Patent Issued to QUALCOMM on April 7 for "Port landing-free low-skew signal distribution with backside metallization and buried rail" (Belgian, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,981, issued on April 7, was assigned to QUALCOMM Inc. (San Diego).

"Port landing-free low-skew signal distribution with backside metallization and buried rail" was invented by Mustafa Badaroglu (Leuven, Belgium) and Zhongze Wang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are integrated circuit structures with buried rails and backside metals for routing input signals to and/or output signals from one or more cells of the integrated circuit structures. Port landing-free connections to input ports and/or from output ports are enabled. As a result, signal routing flexibility is enhanced."

The patent was filed on Sept. 15, 2022...