US Patent Issued to QUALCOMM on April 21 for "Interconnect link with a resilient link mode based on a link status register" (Indian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,608,289, issued on April 21, was assigned to QUALCOMM Inc. (San Diego).

"Interconnect link with a resilient link mode based on a link status register" was invented by Ravindranath Doddi (Hyderabad, India) and Umamaheshwaran V (Salem, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a plurality of chiplets including a first device and a second device. A die-to-die (D2D) interconnect link connects between the first device and the second device. A link training and status state machine (LTSSM) of the IC device is configured to operate the degraded D2D interconnect link in a resilient link mode to provide a pl...