US Patent Issued to QUALCOMM on April 21 for "Apparatus and methods for voltage droop detection in die architectures" (Arizona, California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,672, issued on April 21, was assigned to QUALCOMM Inc. (San Diego).

"Apparatus and methods for voltage droop detection in die architectures" was invented by Amit Aneja (Chandler, Ariz.), Dipti Ranjan Pal (Irvine, Calif.) and Kiran Kumar Malipeddi (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatuses directed to. In some examples, a die package includes voltage logic that provides a voltage to a voltage rail, clock logic that generates a clock signal, and adaptive clock distribution logic that receives the clock signal and the voltage. The adaptive clock distribution logic can increment an event count when the clock signa...