US Patent Issued to QUALCOMM Incorproated on Sept. 8 for "Sensor-based ultrasonic coupling layer evaluation and related user interface functionality" (New York, California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,093, issued on Sept. 8, was assigned to QUALCOMM Incorproated (San Diego).

"Sensor-based ultrasonic coupling layer evaluation and related user interface functionality" was invented by Kaylin McQuillan (Buffalo, N.Y.), Nicholas Buchan (San Jose, Calif.), Stephen Michael Gojevic (Lockport, N.Y.), Chin-Jen Tseng (Fremont, Calif.), Ila Badge (San Jose, Calif.), Emily Kathryn Brooks (Amherst, N.Y.), Ye Zhan (Buffalo, N.Y.) and John Keith Schneider (Williamsville, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some disclosed methods involve controlling an apparatus that includes an ultrasonic receiver system. Some such methods involve receiving ultra...