US Patent Issued to Qorvo US on June 30 for "Die attach system" (Texas Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,561, issued on June 30, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"Die attach system" was invented by Walid Meliane (Plano, Texas) and Christo Bojkov (Plano, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die attach system includes a substrate that has scored grooves or into which stud bumps on a die are then inserted. The additional surface area and flow of the stud bumps into the trenches creates a strong mechanical bond that may withstand repeated thermal cycling. In a further exemplary aspect, the substrate may be covered in a first material, the stud bumps may be made from the same first material, a die attachment material may b...