US Patent Issued to Qorvo US on Feb. 24 for "Double-sided integrated circuit module having an exposed semiconductor die" (North Carolina Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,111, issued on Feb. 24, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"Double-sided integrated circuit module having an exposed semiconductor die" was invented by John Robert Siomkos (Greensboro, N.C.), Edward T. Spears (Stokesdale, N.C.) and Mark Crandall (Oak Ridge, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electro...