US Patent Issued to QINGDAO UNIVERSITY OF TECHNOLOGY on Sept. 23 for "Method for preparing static/dynamic 3D microcrack propagation sensor, sensor and equipment" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,509, issued on Sept. 23, was assigned to QINGDAO UNIVERSITY OF TECHNOLOGY (Qingdao, China).

"Method for preparing static/dynamic 3D microcrack propagation sensor, sensor and equipment" was invented by Jianlin Luo (Qingdao, China), Xiaoyang Zhou (Qingdao, China), Huarong Nie (Qingdao, China), Yibo Gao (Qingdao, China), Zhiqing Li (Qingdao, China) and Min Zhu (Qingdao, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for preparing a static/dynamic three-dimensional (3D) microcrack propagation sensor, a sensor and equipment, belongs to the field of sensor technology. The preparation method includes: preparing a piezoresistive/piezoelectri...