ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,282, issued on May 12, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China) and Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China).

"Method of manufacturing circuit board" was invented by Fu-Yun Shen (Shenzhen, China), Ming-Jaan Ho (New Taipei, Taiwan), Hsiao-Ting Hsu (New Taipei, Taiwan) and Lin-Jie Gao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insula...