ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,589, issued on March 3, was assigned to PROTEC Co. LTD. (Gyeonggi-do, South Korea).
"Method of bonding column type deposits" was invented by Youn Sung Ko (Gyeonggi-do, South Korea) and Geunsik Ahn (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of bonding column type deposits, and more specifically, a method of bonding, to a substrate, column type deposits which are formed in a column shape and connect a substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. The method of bonding the column type deposits to the substrate enables bonding the column type deposi...