ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,139, issued on Feb. 17, was assigned to ProAmpac Holdings Inc. (Cincinnati).
"Ovenable flexible packaging structure" was invented by Vincent Reid (Peterborough, Great Britain), Quang T. Phung (Addlestone, Great Britain) and Kevin Vyse (London).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates generally to flexible product packaging and, in particular, to flexible packaging structures for products such as food products stored and transported for later reheating or cooking. In one aspect, an ovenable flexible packaging structure includes a paper layer having a first major surface and a second major surface opposite the first...