ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,698, issued on May 19, was assigned to PRIME POLYMER Co. LTD. (Tokyo).
"Ethylene resin composition and film" was invented by Keiko Sekiya (Sodegaura, Japan), Masao Suzuki (Chiba, Japan) and Yuta Kudo (Ichihara, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An ethylene-based resin composition having the following requirements (1) to (4) as a material such as packaging material, a film having strength for the protection and rigidity (e.g., easy opening and self-standability on packaging contents) in an excellent balance: (1) A melt flow rate (190deg C., 2.16 kg load) is 0.1 g/10 min or more and 1.0 g/10 min or less, (2) a density is 915 kg/m3 or...