ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,699,058, issued on Aug. 4, was assigned to PRECITEC OPTRONIK GMBH (Neu-Isenburg, Germany).
"Apparatus and method for measuring wafers" was invented by Tobias Beck (Heusenstamm, Germany), Simon Mieth (Frankfurt am Main, Germany), Oliver Schulz (Berlin), Corinna Weigelt (Langen, Germany) and Stephan WeiB (Rodgau, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device for measuring wafers includes an optical coherence tomograph, which generates a measuring light beam and directs it onto the wafer via an optical system. A scanning device deflects the measuring light beam in two spatial directions. A control unit controls the scanning device so that ...