US Patent Issued to POWERTECH TECHNOLOGY on Jan. 27 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,847, issued on Jan. 27, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan).

"Package structure and manufacturing method thereof" was invented by Ching-Wei Liao (Hsinchu County, Taiwan) and Shang-Yu Chang Chien (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a manufacturing method thereof are provided. The package structure includes a redistribution layer, a conductive element, an active chip, an encapsulation layer, another redistribution layer, and a conductive terminal. The conductive element, the active chip, and the encapsulation layer are disposed on the redistribution layer and the...