US Patent Issued to Powerchip Semiconductor Manufacturing on March 3 for "Stacked semiconductor device and method of fabricating the same" (Japanese Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,862, issued on March 3, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Stacked semiconductor device and method of fabricating the same" was invented by Yasuhiro Konishi (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked semiconductor device includes first chips and a second chip. The first chips are arranged in an array, and includes first and second type through vias, an internal wire layer, a redistribution line and conductive pins. The internal wire layer is disposed on and electrically connected to the first and second type through vias. The redistribution line is disposed on and electrically ...