US Patent Issued to Powerchip Semiconductor Manufacturing on June 30 for "Semiconductor device and method of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,331, issued on June 30, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Semiconductor device and method of forming the same" was invented by Meng-Han Lin (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device and a method for forming the same. The semiconductor device includes a substrate including first to third active regions, a device isolation structure defining the first to third active regions in the substrate, first and second devices buried in the first and second active regions, respectively, a third device disposed on the third active regio...