ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,017, issued on Feb. 24, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).
"Wafer stacking method" was invented by Chih Feng Sung (Hsinchu, Taiwan), Wei Han Huang (Hsinchu, Taiwan), Ming-Jui Tsai (Hsinchu, Taiwan), Yu Chi Chen (Hsinchu, Taiwan), Yung-Hsiang Chang (Hsinchu, Taiwan), Chun-Lin Lu (Hsinchu, Taiwan) and Shih-Ping Lee (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer stacking method includes the following steps. A first wafer is provided. A second wafer is bonded to the first wafer to form a first wafer stack structure. A first edge defect inspection is performed on the first wafer stack s...