US Patent Issued to Powerchip Semiconductor Manufacturing on April 21 for "Wafer stacking process" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,797, issued on April 21, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan).

"Wafer stacking process" was invented by Chih-Feng Sung (Hsinchu, Taiwan), Chih-Hao Chuang (Hsinchu, Taiwan), Chun-Lin Lu (Hsinchu, Taiwan), Shih-Ping Lee (Hsinchu, Taiwan), Li-Han Chiu (Hsinchu, Taiwan) and Yi-Kai Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the...