US Patent Issued to POINT ENGINEERING on Dec. 23 for "Anodized film substrate base, anodized film substrate part having same, anodized film-based interposer having same, and semiconductor package having same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,091, issued on Dec. 23, was assigned to POINT ENGINEERING Co. LTD. (Chungcheongnam-do, South Korea).

"Anodized film substrate base, anodized film substrate part having same, anodized film-based interposer having same, and semiconductor package having same" was invented by Bum Mo Ahn (Gyeonggi-do, South Korea), Seung Ho Park (Gyeonggi-do, South Korea) and Sung Hyun Byun (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to an anodized film substrate base made of an anodized oxide film, an anodized film substrate part including a vertical conductive part provided inside the anodized film substrate ba...