ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,018, issued on Dec. 2, was assigned to PLASMA-THERM LLC (St. Petersburg, Fla.).

"Method and apparatus for plasma dicing a semi-conductor wafer" was invented by Linnell Martinez (Lakeland, Fla.), David Pays-Volard (St. Petersburg, Fla.), Chris Johnson (St. Petersburg, Fla.), David Johnson (Cleveland, Ga.), Russell Westerman (Land O' Lakes, Fla.) and Gordon M. Grivna (Mesa, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece ...