US Patent Issued to PI Advanced Materials on Dec. 23 for "Low-dielectric-constant polyimide composite powder, and method for producing same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,596, issued on Dec. 23, was assigned to PI Advanced Materials Co. Ltd..

"Low-dielectric-constant polyimide composite powder, and method for producing same" was invented by Jin-Seok Jeon (Chungcheongbuk-do, South Korea), Min-Sang Cho (Chungcheongbuk-do, South Korea) and Kil-Nam Lee (Chungcheongbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides: a polyimide composite powder which includes 1-30 wt % of a fluorine-based resin filler, and has excellent low dielectric properties; and a production method using water as a dispersion medium. Also provided are a molded body including the polyimide composite powde...