US Patent Issued to PEKING UNIVERSITY on Dec. 2 for "Silicon-based fan out package structure and preparation method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,033, issued on Dec. 2, was assigned to PEKING UNIVERSITY (Beijing).

"Silicon-based fan out package structure and preparation method therefor" was invented by Wei Wang (Beijing), Yuchi Yang (Beijing) and Jianyu Du (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a silicon-based fan out package structure including embedded manifold type microchannels, which includes: a chip, which includes a substrate and embedded microchannels located on a back of the substrate; a silicon-based adapter plate, which includes a groove for burying the chip, a manifold channel located below the groove and communicated with the groo...