ALEXANDRIA, Va., April 21 -- United States Patent no. 12,609,139, issued on April 21, was assigned to PEGATRON Corp. (Taipei City, Taiwan).
"Electronic module and heat dissipation assembly" was invented by Yu-Yang Huang (Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic module and a heat dissipation assembly thereof are provided. The electronic module includes an electronic component between a bottom of a heat fin and a bottom plate of a base, and a heat dissipation assembly including the heat fin, the base, and multiple fasteners. Each of two opposite sides of the bottom has a pair of first and second screw holes. The first screw holes are between the second screw holes. The b...