ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,022, issued on Nov. 11, was assigned to Panduit Corp. (Tinley Park, Ill.).
"Communication jack having a dielectric film between plug interface contacts" was invented by Satish I. Patel (Roselle, Ill.), Roman J. Churnovic (Joliet, Ill.) and Jean de Dieu Muntangana (Chicago).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capac...