US Patent Issued to Panduit on July 14 for "High density fiber cassette and enclosure" (Illinois, Indiana Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,242, issued on July 14, was assigned to Panduit Corp. (Tinley Park, Ill.).

"High density fiber cassette and enclosure" was invented by Thomas M. Sedor (Orland Park, Ill.), Benjamin J. Berridge (Griffith, Ind.), Max W. Hibner (Glenview, Ill.) and Gregory L. Kuffel (Plainfield, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-density fiber cassette and enclosure for installing the cassette are part of a cable management system. The cassette provides a more efficient design enabling installation of additional fiber connecter adapters, thus resulting in high fiber connector density within a given RU space."

The patent was filed on Aug. 15, 20...