US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Sept. 15 for "Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,543, issued on Sept. 15, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same" was invented by Yasunori Nishiguchi (Osaka, Japan), Hirosuke Saito (Osaka, Japan) and Taito Hieida (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition contains a preliminary reaction product (A) obtained by previously reacting a mixture containing a maleimide compound (a1) having two or more maleimide groups in a molecule and a phosphorus-containing compound (a2) that is at least one of...