US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on June 2 for "Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,972, issued on June 2, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board" was invented by Hiroaki Umehara (Fukushima, Japan) and Hirosuke Saito (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition contains a polyphenylene ether compound having a carbon-carbon unsaturated double bond at the terminal, a maleimide compound (A) having an indane structure in the molecule, and an inorganic filler."

The patent was filed on Jan. 8, 2021, under Application No. 18/025,289.

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