US Patent Issued to Panasonic Intellectual Property Management on Dec. 16 for "Wiring transfer plate, wiring-equipped wiring transfer plate, wiring body intermediate material, and method for manufacturing wiring body" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,554, issued on Dec. 16, was assigned to Panasonic Intellectual Property Management Co. Ltd. (Osaka, Japan).

"Wiring transfer plate, wiring-equipped wiring transfer plate, wiring body intermediate material, and method for manufacturing wiring body" was invented by Takayoshi Nirengi (Osaka, Japan), Akihiro Oishi (Osaka, Japan), Tsutomu Aisaka (Osaka, Japan), Daisuke Matsushita (Osaka, Japan), Jumpei Iwanaga (Osaka, Japan) and Tadashi Tojo (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring transfer plate for forming wiring to be transferred to another component includes: a base; a plating base material layer formed as a release layer...