ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,876, issued on Sept. 9, was assigned to PANASONIC AUTOMOTIVE SYSTEMS Co. LTD. (Kanagawa, Japan).
"Semiconductor package" was invented by Kazuhito Tanaka (Shiga, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package according to the present disclosure includes: a plurality of semiconductor chips that include a system on chip (SoC) in which a plurality of integrated circuits including a processor core and a microcomputer are integrated on a single chip; a power management integrated circuit (IC) for performing power management on the plurality of semiconductor chips; a plurality of shunt resistors each of which is mounted in se...