ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,167, issued on June 2, was assigned to Pac Tech-Packaging Technologies GmbH (Nauen, Germany).
"Press-forming device for depositing solder and producing individual solder bodies" was invented by Andrej Kolbasow (Paulinenaue, Germany) and Matthias Fettke (Berlin).
According to the abstract* released by the U.S. Patent & Trademark Office: "A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into...