US Patent Issued to Pac Tech-Packaging Technologies on July 14 for "Laser-assisted soldering apparatus and solder deposition machine" (German Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,881, issued on July 14, was assigned to Pac Tech-Packaging Technologies GmbH (Nauen, Germany).

"Laser-assisted soldering apparatus and solder deposition machine" was invented by Matthias Fettke (Berlin) and Jan Hoffmann (Michendorf, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser-assisted soldering apparatus includes a solder jetting section and a laser coupling unit. The solder jetting section includes a jetting nozzle and a solder body holding capillary adapted to hold a solder body that is being liquefied by a laser beam. The laser coupling unit includes an optical window, a laser entry, a laser passage, a fastening section, and a ...