US Patent Issued to PAC TECH-PACKAGING TECHNOLOGIES on Dec. 2 for "Method for monitoring a laser soldering process, and laser soldering system using a spectroscope device" (German Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,500, issued on Dec. 2, was assigned to PAC TECH-PACKAGING TECHNOLOGIES GMBH (Nauen, Germany).

"Method for monitoring a laser soldering process, and laser soldering system using a spectroscope device" was invented by Matthias Fettke (Berlin), Timo Kubsch (Berlin), Andrej Kolbasow (Paulinenaue, Germany) and Gero Bonow (Falkensee, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser s...