US Patent Issued to OpTek Systems on July 15 for "Assembly and method for cleaving a glass body with a laser" (British, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,831, issued on July 15, was assigned to OpTek Systems Inc. (Greenville, S.C.).

"Assembly and method for cleaving a glass body with a laser" was invented by Duane Dinkel (Simpsonville, S.C.), Sean Kelly (Maudlin, S.C.), Mike O'Key (Oxford, Great Britain) and Camden Druga (Greenville, S.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogo...