US Patent Issued to OLYMPUS on Dec. 9 for "Method of bonding operation wire and medical equipment" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,612, issued on Dec. 9, was assigned to OLYMPUS Corp. (Tokyo).

"Method of bonding operation wire and medical equipment" was invented by Takehiro Ishikawa (Hachioji, Japan), Keiichi Asami (Hachioji, Japan) and Tomonori Imamura (Hino, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of bonding an operation wire used in a medical equipment. The method includes: locally heating an adjacent region of a bonding region of an operation wire to generate an oxide in the adjacent region of the operation wire; coating the bonding region and the adjacent region with flux to remove an oxide in the bonding region and the oxide in the adjacen...