US Patent Issued to NXP USA on July 14 for "Semiconductor device quad-flat-no-leads package with trenches for improved soldering and method of making thereof" (Chinese, Malaysian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,192, issued on July 14, was assigned to NXP USA Inc. (Austin, Texas).

"Semiconductor device quad-flat-no-leads package with trenches for improved soldering and method of making thereof" was invented by Meng Kong Lye (Shah Alam, Malaysia), Zhijie Wang (Tianjin, China), You Ge (Tianjin, China) and Zhiming Li (Tianjin, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to a first aspect of the present invention there is provided a quad-flat-no-leads (QFN) packaged semiconductor device having a QFN bottom surface and QFN side faces, wherein the QFN side faces each comprise an upper portion and a recessed lower portion, the QFN packaged semic...