US Patent Issued to NXP USA on Aug. 25 for "Power amplifier modules and systems containing electromagnetic bandgap isolation arrays" (French, American Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,668, issued on Aug. 25, was assigned to NXP USA INC. (Austin, Texas).

"Power amplifier modules and systems containing electromagnetic bandgap isolation arrays" was invented by Yu-Ting David Wu (Schaumburg, Ill.), Pascal Peyrot (Frouzins, France) and Xavier Hue (Frouzins, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "Power amplifier systems including power amplifier modules (PAMs) and electromagnetic bandgap (EBG) isolation structures are disclosed. In embodiments, the power amplifier system includes a printed circuit board (PCB) and a PAM mounted to the PCB in an inverted orientation. The PCB has a PCB frontside on which a PAM mount region i...