ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,616, issued on April 14, was assigned to NXP USA INC. (Austin, Texas).
"Power amplifier module with interleaved wirebonds" was invented by Vikas Shilimkar (Chandler, Ariz.), Joseph Agyemang Duah (Gilbert, Ariz.) and Joseph Gerard Schultz (Wheaton, Ill.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a Doherty amplifier having a first amplifier die having a first output terminal, and a second amplifier die with a second output terminal. A device may include an output impedance matching network connected to an output terminal of the Doherty amplifier. A device may include an impedance inversion element connected to the second output ...