US Patent Issued to NXP on July 14 for "Semiconductor device with leadframe spacer and method therefor" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,185, issued on July 14, was assigned to NXP B.V. (Eindhoven, Netherlands).

"Semiconductor device with leadframe spacer and method therefor" was invented by Yao Jung Chang (Kaohsiung, Taiwan), Tzu Ya Fang (Tainan City, Taiwan), Yu Ling Tsai (Kaohsiung City, Taiwan), Jian Nian Chen (Kosiiung City, Taiwan) and Yen-Chih Lin (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is provided. The method includes affixing a spacer structure to a bottom side of a plurality of leads of a leadframe. A semiconductor die is attached to a top side of a die pad of the leadframe. The semiconductor die,...