US Patent Issued to NXP on Feb. 10 for "Printed circuit board (PCB) including a vertical launcher having a signal via for radiating signal energy through a PCB channel region" (German, Dutch Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,877, issued on Feb. 10, was assigned to NXP B.V. (Eindhoven, Netherlands).

"Printed circuit board (PCB) including a vertical launcher having a signal via for radiating signal energy through a PCB channel region" was invented by Abdellatif Zanati (Hamburg, Germany), Adrianus Buijsman (Nijmegen, Netherlands) and Mark Steigemann (Ebstorf, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening...