US Patent Issued to NVIDIA on Oct. 20 for "Thermal measurement for complex thermal stack up products" (California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,768,879, issued on Oct. 20, was assigned to NVIDIA Corp. (Santa Clara, Calif.).

"Thermal measurement for complex thermal stack up products" was invented by Celing Liu (Morgan Hill, Calif.) and Gunaseelan Ponnuvel (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Testing chip or board packages for thermal failure can be conducted at various stages of the package's life cycle. Conventional testing can detect a thermal failure of the package, though conventional testing does not detect at which specific thermal layer a failure has occurred. By applying an R deviation percentage to the measured thermal parameters received from a testing unit,...