US Patent Issued to NVIDIA on March 24 for "Clustered microvia structure for a high-density interface PCB" (California Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,146, issued on March 24, was assigned to NVIDIA Corp. (Santa Clara, Calif.).

"Clustered microvia structure for a high-density interface PCB" was invented by Mingyi Yu (Saratoga, Calif.), Gregory Patrick Bodi (Santa Cruz, Calif.), Ananta H. Attaluri (San Jose, Calif.) and Duy Nguyen (Rohnert Park, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to various embodiments, a printed circuit board includes: a buried via formed through one or more layers of the printed circuit board; a first conductive pad that is formed on a first end of the buried via; a first conductive via that is formed through a first layer of the printed circuit boar...