ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,824, issued on Jan. 27, was assigned to NVIDIA Corp. (Santa Clara, Calif.).
"Die substrate to optimize signal routing" was invented by Shuanghu Yan (Santa Clara, Calif.), Xiaozhuo Cai (Santa Clara, Calif.), Hao Zhu (Santa Clara, Calif.), Dinghai Yi (Santa Clara, Calif.) and Huaming Li (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die substrate, including a dielectric body, the body having a first body surface, a second body surface on an opposite side and body edge surfaces located in between. Current-carrying metal lines located in the dielectric body. One or more of the metal lines routed to one or more of the body edge sur...