US Patent Issued to NUTECH VENTURES on July 7 for "Wrapping perovskite grains with silica shells for improved stability and efficiency of perovskite electronic devices" (American, Australian Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,581, issued on July 7, was assigned to NUTECH VENTURES (Lincoln, Neb.).

"Wrapping perovskite grains with silica shells for improved stability and efficiency of perovskite electronic devices" was invented by Jinsong Huang (Lincoln, Neb.) and Yang Bai (Westlake, Australia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for enhancing the stability and efficiency of perovskite materials, and devices incorporating such perovskite materials. A method of making a perovskite layer includes mixing a perovskite solution with a silica shell precursor solution to produce a perovskite-silica precursor solution, and spin casting or drop casting ...