US Patent Issued to NTT on May 12 for "Semiconductor module inspection device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,625,161, issued on May 12, was assigned to NTT Inc. (Tokyo).

"Semiconductor module inspection device" was invented by Masayuki Takahashi (Musashino, Japan) and Kentaro Honda (Musashino, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module inspection device of the present disclosure includes a PCB substrate, an IC socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate, a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate. In an embodiment,...