US Patent Issued to Northwestern University on May 5 for "High-throughput quantitative measurement of bulk mechanical properties of soft materials" (Illinois, California Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,618,761, issued on May 5, was assigned to Northwestern University (Evanston, Ill.).

"High-throughput quantitative measurement of bulk mechanical properties of soft materials" was invented by Muzhou Wang (Evanston, Ill.), Justin E. Griffith (Naperville, Ill.), Yusu Chen (Fremont, Calif.), Kenneth R. Shull (Evanston, Ill.) and Danielle Tullman-Ercek (Wilmette, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided herein are systems and methods for carrying out high-throughput quantitative measurements of bulk mechanical properties of soft materials. The systems include a centrifuge, solid particles, and sample wells. In the systems and methods, sampl...