US Patent Issued to North Minzu University on April 7 for "Preparation method of sub-micron powder of high-entropy nitride via nitride thermal reduction with soft mechano-chemical assistance" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,213, issued on April 7, was assigned to North Minzu University (Yinchuan, China).

"Preparation method of sub-micron powder of high-entropy nitride via nitride thermal reduction with soft mechano-chemical assistance" was invented by Youjun Lu (Ningxia, China), Lutong Yang (Ningxia, China), Xiang Liu (Ningxia, China), Chuyun Wang (Ningxia, China), Wuyang Song (Ningxia, China) and Jiahao Xu (Ningxia, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A preparation method of submicron powder of high-entropy nitride via nitride thermal reduction with mechano-chemical assistance, comprising material preparation-grinding-activation-preforming-reaction. I...